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filingDate 2008-02-02^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2008-06-19^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2008146018-A1
titleOfInvention Chip structure and method for fabrication the same
abstract A method for fabricating a metallization structure comprises depositing a first metal layer; depositing a first pattern-defining layer over said first metal layer, a first opening in said first pattern-defining layer exposes said first metal layer; depositing a second metal layer over said first metal layer exposed by said first opening; depositing a second pattern-defining layer over said second metal layer, a second opening in said second pattern-defining layer exposes said second metal layer; depositing a third metal layer over said second metal layer exposed by said second opening; removing said second pattern-defining layer; removing said first pattern-defining layer; and removing said first metal layer not under said second metal layer.
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priorityDate 2004-08-12^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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