| abstract |
Example embodiments relate to a semiconductor package having a semiconductor chip provided in a substrate and a method of fabricating the same. The semiconductor package may include a semiconductor substrate having a first through hole and a plurality of second through holes spaced apart from the first through hole. A semiconductor chip having a plurality of pads may be disposed in the first through hole. Solder balls electrically connected to the pads may be attached to end portions of the second through holes. A plurality of the above semiconductor substrates may be stacked to form a multi-chip package. |