| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_773a11b00d9fad5acf3fd40483c28c89
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_906fb811b6db25bf1cc32c0e58be38e6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1efed482dd666e7aff9e07667dee2fca
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_dff1519489661c44a534e803530fb54d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_73890c312131f68e1dd69e4eabba1590 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00095 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-00 |
| filingDate |
2007-04-16^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3754a9b3cbeff12643e7b1464ef464ad
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8afab6ed68c537ba64360decb4a59f49
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cff21c940eb346271e7c8d1a80b6b4ec
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_295d767142785ac0393ede214e205036
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_56a217fa5840c1a39664e100db42cf6a |
| publicationDate |
2008-08-07^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2008188024-A1 |
| titleOfInvention |
Method of fabricating micro mechanical moving member and metal interconnects thereof |
| abstract |
A method of fabricating micro mechanical moving member and metal interconnects thereof. A first metal interconnect pattern and a second metal interconnect pattern disposed thereon are formed on a substrate by plating processes. Subsequently, an inter-metal dielectric layer is formed on the substrate, the first metal interconnect pattern and the second metal interconnect pattern. The inter-metal dielectric layer is then planarized and the second metal interconnect pattern is exposed. After that, at least one micro mechanical moving member electrically connected to the second metal interconnect pattern is formed on the inter-metal dielectric layer by plating techniques. |
| priorityDate |
2007-02-06^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |