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publicationDate 2008-09-18^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2008226841-A1
titleOfInvention Diamond-like carbon films with low dielectric constant and high mechanical strength
abstract The present invention discloses a method including: providing a substrate; and sequentially stacking layers of two or more diamond-like carbon (DLC) films over the substrate to form a composite dielectric film, the composite dielectric film having a k value of about 1.5 or lower, the composite dielectric film having a Young's modulus of elasticity of about 25 GigaPascals or higher.
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