| abstract |
The invention relates to an electronic component comprising a flexible substrate, on the surface of which is arranged a layer stack composed of thin layers, containing at least one electrical functional layer composed of an electrically conductive or semiconducting material, wherein the component comprises at least a first material, a layered second material and a layered third material and wherein, as seen perpendicular to the surface of the substrate the first material is followed by the second material and the second material is followed by the third material, wherein a first adhesion force of the second material to the first material is lower than a second adhesion force of the third material to the first material and the second material has at least one opening, via which the third material is connected to the first material in order to increase the adhesion of the second material to the first material. |