| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-056
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0023
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0723 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02B6-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02B6-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02B6-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02B6-1221
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02B6-43
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-045
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02B6-122
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-107
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0274
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02B6-136
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G02B6-132 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B05D5-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G02B6-12 |
| filingDate |
2009-01-23^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e817d5fc18e85b950a681491cd49cd64
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5d07decb92ac4186632c58bd4cdc39f2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e84dba53f3ee2874af6f193ff85a6540
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ce621eb4b8239c3e0f20475e1346fd57 |
| publicationDate |
2009-07-30^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2009190880-A1 |
| titleOfInvention |
Manufacturing method of opto-electric hybrid board and opto-electric hybrid board obtained thereby |
| abstract |
A method of manufacturing an opto-electric hybrid board which is capable of reducing the number of steps for the manufacture of the opto-electric hybrid board and which achieves the reduction in thickness of the opto-electric hybrid board to be manufactured, and an opto-electric hybrid board obtained thereby. A plurality of protruding cores (optical interconnect lines) 3 are formed in a predetermined pattern. Thereafter, a thin metal film 4 is formed in grooves defined between adjacent ones of the cores 3. Via-filling plating is performed on the thin metal film 4 to fill the above-mentioned grooves with a via-filling plated layer 6 a. The plated layer 6 a serves as electrical interconnect lines 6. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2012195564-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8712204-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7809228-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8503848-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009103858-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10705293-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8693814-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011013866-A1 |
| priorityDate |
2008-01-24^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |