http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010081235-A1

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http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G06K19-07779
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01Q7-005
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-78
filingDate 2007-11-26^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_56123aa7e886b0ea2ea1b8148ad0b405
publicationDate 2010-04-01^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2010081235-A1
titleOfInvention Method for manufacturing rf powder
abstract A method for manufacturing RF powder wherein the RF powder is composed of a large amount of particles and used as collective RF powder (a powdery entity); and a large amount of RF powder particles can be obtained from a wafer in a stable manner and at a high yield is provided. n The method for manufacturing RF powder is a method for manufacturing RF powder composed of a large amount of particles 11 a each having a substrate 12 and a magnetic coupling circuit device 15 . This method includes a step S 11 of forming many antenna circuit devices 39 on a wafer 40 ; a gas dicing step S 13 for drawing dicing grooves on a wafer to locate positions of separation of magnetic coupling circuit devices; a protection film formation step S 14 for coating surrounding areas of the magnetic coupling circuit devices with a protection film; a reinforcement step S 15 for attaching the wafer to a supporting plate using an adhesive sheet; a grinding step S 16 for grinding the backside of the wafer until the dicing grooves are reached; and a separation step S 17 for separating the circuit devices by removing the supporting plate.
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