| abstract |
A microphone package includes a carrier, a cap, a first silicon-based microphone, and a first integrated circuit chip. The carrier has a first storage space. The cap has a planar part contacting the carrier and a plurality of flanges extending from the planar part and surrounding the carrier. The first silicon-based microphone is disposed in the first storage space and covered by the cap. The first integrated circuit chip is disposed in the first storage space, electrically connected to the first silicon-based microphone, and covered by the cap. |