http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010181663-A1

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publicationDate 2010-07-22^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2010181663-A1
titleOfInvention Low compressive force, non-silicone, high thermal conducting formulation for thermal interface material and package
abstract An improved thermal interface material for semiconductor devices is provided. More particularly, low compressive force, non-silicone, high thermal conductivity formulations for thermal interface material is provided. The thermal interface material comprises a composition of non-silicone organics exhibiting thermal conductivity of approximately 5.5 W/mK or greater and a compressed bond-line thickness of approximately 100 microns or less using a compressive force of approximately 100 psi or less.
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