patent/US-2010258921-A1

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010258921-A1

Outgoing Links

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filingDate	2009-08-31^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8cfbf9005193bd839af6eebb00208499 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d6da2a13f0491ee9768ca00520d24c70 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_806eb5575bffb8d1a348614aed77f5c2 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a8da605538ecb1a7721ff88bf8a6c221
publicationDate	2010-10-14^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	US-2010258921-A1
titleOfInvention	Advanced quad flat-leaded package structure and manufacturing method thereof
abstract	The advanced quad flat non-leaded package structure includes a carrier, a chip, a plurality of wires, and a molding compound. The carrier includes a die pad and a plurality of leads. The inner leads of the leads electively have a plurality of locking grooves for enhancing the adhesion between the inner leads and the surrounding molding compound.
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priorityDate	2009-04-10^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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