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publicationNumber US-2011180887-A1
titleOfInvention Encapsulation, MEMS and Encapsulation Method
abstract A method and encapsulation of a sensitive mechanical component structure in one embodiment includes a semiconductor substrate, and a film covering a component structure on the substrate, said film including at least one polymer layer, and at least one cavity formed between the component structure and the film, wherein at least one through contact penetrates through the film.
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