http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011212617-A1
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_696ca0ae93d5cf5a686273601361781f |
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02074 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-321 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-28 |
filingDate | 2009-09-02^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_af4541a8495b615ad8c567da073a6689 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b987a658a4ff54cfd12727c62f545117 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c6cedfab4efe83dc82970e69708359f7 |
publicationDate | 2011-09-01^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | US-2011212617-A1 |
titleOfInvention | Liquid for protecting copper wiring surface and method for manufacturing semiconductor circuit element |
abstract | A copper wiring material surface protective liquid is provided that is used in production of a semiconductor circuit device containing copper wiring, and consists of an aqueous solvent and an acetylene alcohol compound containing at least 3-phenyl-2-propyn-1-ol. A method for producing a semiconductor circuit device is provided that contains: forming an insulating film and/or a diffusion preventing film on a silicon substrate; then forming a copper film by a sputtering; then forming a copper film or a copper alloy film containing 80% by mass or more of copper thereon by a plating method; and flattening the film by a chemical mechanical polishing (CMP) method, thereby providing a semiconductor substrate containing a flattened copper wiring, in which the semiconductor substrate having an exposed surface of a copper wiring material is treated by making in contact with the copper wiring material surface protective liquid. |
priorityDate | 2008-09-08^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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