| abstract |
A packaging substrate is disclosed, which includes: an encapsulant having opposite first and second surfaces; a plurality of conductive elements embedded in the encapsulant, wherein each of the conductive elements has a first conductive pad exposed from the first surface of the encapsulant and a second conductive pad exposed from the second surface of the encapsulant; and a protection layer formed on the second surface of the encapsulant and the second conductive pads so as to protect the second surface of the encapsulant from being scratched. |