| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bce787970b69aeb08d159e7c101c9ed7 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N21-55
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01J3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N21-9501
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N2021-8438
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N2021-8416 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01B11-0683
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G05B15-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B49-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B49-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-105
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-042 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G05B15-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B49-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B49-12 |
| filingDate |
2014-06-09^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_86238df507e4e3c70f4ae5b8ff5ff4b9 |
| publicationDate |
2015-01-22^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2015024659-A1 |
| titleOfInvention |
Method of Controlling Polishing |
| abstract |
A method of controlling polishing includes polishing a substrate of a non-metallic layer undergoing polishing and a metal layer underlying the non-metallic layer; storing a metal reference spectrum, the metal reference spectrum being a spectrum of light reflected from a same metal material as the metal layer; measuring a sequence of raw spectra of light reflected from the substrate during polishing with an in-situ optical monitoring system; normalizing each raw spectrum in the sequence of spectra to generate a sequence of normalized spectra, of which normalizing includes a division operation where the measured spectrum is in the numerator and the metal reference spectrum is in the denominator; and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on at least one normalized predetermined spectrum from the sequence of normalized spectra. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I811249-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2014024291-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9248544-B2 |
| priorityDate |
2011-04-26^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |