http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015040388-A1

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0530c14c7a5b9a232bb9e17ec7fa5d16
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-4913
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0209
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F21Y2101-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F21Y2115-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10106
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4655
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F21K9-90
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-056
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0061
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-12
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/F21K99-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00
filingDate 2013-03-20^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2f6682a331b5ed33490893487b521e7a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5a02fbb2154c52e23e151f4796b5f95b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fe6b23689027afea677dc36e6821f853
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a50be20a2460f9ef12ff60c787d2c6a3
publicationDate 2015-02-12^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2015040388-A1
titleOfInvention Application of Dielectric Layer and Circuit Traces on Heat Sink
abstract A dielectric layer is directly applied onto the surface of a heat sink part. For example, the composition for making the dielectric layer may be made into a paste or ink and then printed as a paste or ink, or applied with some other equivalent method, such as a lamination technique. The electrical circuit traces are then printed in a similar fashion onto the dielectric layer in the required pattern for whatever circuitry is to be applied. That circuitry (e.g., circuit elements) is then attached to the electrical traces as needed for the particular application.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-108679583-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015373832-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2017290147-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9713263-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2018132353-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2017301605-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015201504-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10074589-B2
priorityDate 2012-03-20^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6110649-A
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5359268
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID90455
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID297
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419491804
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559581
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559503
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID418354341
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23978

Showing number of triples: 1 to 49 of 49.