| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_28f232e2b6b8223908762b7c10a42748 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F21Y2115-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10416
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F21V19-0055
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F21Y2101-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3677
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10106
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F21Y2105-10 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-167
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-021
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F21V29-70
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-642
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-64
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-486 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/F21V29-70
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-64 |
| filingDate |
2014-11-16^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_451eaa7708866bb4ce429948194beb36 |
| publicationDate |
2015-10-01^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2015280087-A1 |
| titleOfInvention |
Light-emitting diode having a silicon submount and light-emitting diode lamp |
| abstract |
A light-emitting diode having a silicon submount includes a silicon submount and a light-emitting diode (LED) chip. The silicon submount includes a power management integrated circuit formed in an inside of the silicon submount, a P-electrode formed on a bottom side thereof, an N-electrode formed on the bottom side thereof, and a heat dissipation ground portion formed on the bottom side thereof. The power management integrated circuit is electrically coupled to the P-electrode and the N-electrode. The LED chip is eutecticly bonded to a top side of the silicon submount, and the LED chip is electrically coupled to the P-electrode and the N-electrode. A heat-dissipation channel is defined from the LED chip to the heat dissipation ground portion via the inside of the silicon submount. The power management integrated circuit replaces a conventional power supply controller, thereby providing a more optimized LED. |
| priorityDate |
2014-03-26^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |