http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015303246-A1

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filingDate 2014-06-05^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_11d5571095e20f83d02680beb1e067d6
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publicationDate 2015-10-22^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2015303246-A1
titleOfInvention Systems and methods for fabricating a polycrystaline semiconductor resistor on a semiconductor substrate
abstract In accordance with embodiments of the present disclosure, an integrated circuit may include at least one region of shallow-trench isolation field oxide, at least one region of dummy diffusion, and a polycrystalline semiconductor resistor. The at least one region of shallow-trench isolation field oxide may be formed on a semiconductor substrate. The at least one region of dummy diffusion may be formed adjacent to the at least one region of shallow-trench isolation field oxide on the semiconductor substrate. The polycrystalline semiconductor resistor may comprise at least one resistor arm formed with a polycrystalline semiconductor material, wherein the at least one resistor arm is formed over each of the at least one region of shallow-trench isolation field oxide and the at least one region of dummy diffusion.
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priorityDate 2014-04-16^^<http://www.w3.org/2001/XMLSchema#date>
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