| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4e0f2c3a61236d36f1959cab64303922 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2310-0481
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T156-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1157
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01B2210-009
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4652 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01G45-1207
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-385
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-389
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4652 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 |
| filingDate |
2016-04-15^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_144dd1fa12961baa680c2f1b7d8428c5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fda2deb7009741eab00ed65bfced3c4e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9738b0b1c6d1fd39125fae7da666c7fd
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_236e73628d49bd6e7e63c1b6d5b6dc94 |
| publicationDate |
2017-01-26^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2017027065-A1 |
| titleOfInvention |
Methods Of Treating Copper Surfaces For Enhancing Adhesion To Organic Substrates For Use In Printed Circuit Boards |
| abstract |
Embodiments of the present invention relates generally to the manufacture of printed circuit boards (PCB's) or printed wiring boards (PWB's), and particularly to methods for treating smooth copper surfaces to increase the adhesion between a copper surface and an organic substrate. More particularly, embodiments of the present invention related to methods of achieving improved bonding strength of PCBs without roughening the topography of the copper surface. The bonding interface between the treated copper and the resin layer of the PCB exhibits excellent resistance to heat, moisture, and chemicals involved in post-lamination process steps. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11781236-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10829846-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11149202-B1 |
| priorityDate |
2010-07-06^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |