| abstract |
Multi-layer cover tape constructions include a polymeric substrate with a low adhesion backsize coating layer on one surface and an adhesive layer on the other surface, with a conductive film construction adhered to a portion of the adhesive layer such that portions of the adhesive remain exposed. The conductive film construction includes a polymeric substrate with an exposed layer of abrasion-resistant, electrically conductive nano-scale graphite coated by buff coating. Other multi-layer cover tape constructions include a polymeric substrate with a low adhesion backsize coating layer on one surface, and an exposed layer of abrasion-resistant, electrically conductive nano-scale graphite particles coated on the other surface. Stripes of adhesive are present on a portion of the electrically conductive coating such that portions of the electrically conductive coating remain exposed between the adhesive stripes. Carrier tapes include a plurality of indented segments for accommodating electronic components and are releasably sealed by a cover tape. |