| abstract |
Tamper-respondent assemblies and methods of fabrication are provided which include an inner enclosure, a tamper-respondent sensor(s), a protective wrap(s) and an outer enclosure. The inner enclosure is sized to receive one or more electronic components to be protected, and the tamper-respondent sensor(s) wraps around the inner enclosure. The protective wrap(s) overlies and wraps around the tamper-respondent sensor(s) and inner enclosure, and together the inner enclosure, tamper-respondent sensor(s), and protective wrap(s) form a tamper-respondent subassembly. The outer enclosure receives and surrounds, at least in part, the tamper-respondent subassembly, with the tamper-respondent sensor(s) and protective wrap(s) disposed between the inner enclosure and the outer enclosure. When operative, the inner enclosure, tamper-respondent sensor(s), protective wrap(s) and outer enclosure are coupled together and facilitate conduction of heat from the electronic component(s) out to the outer enclosure. |