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filingDate 2017-01-23^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2017-07-06^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2017194275-A1
titleOfInvention Memory device structure
abstract A front-end method of fabricating nickel plated caps over copper bond pads used in a memory device. The method provides protection of the bond pads from an oxidizing atmosphere without exposing sensitive structures in the memory device to the copper during fabrication.
priorityDate 2004-07-30^^<http://www.w3.org/2001/XMLSchema#date>
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