http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2018009195-A1

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filingDate 2016-01-13^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ad6f9b43df72204aed30eeea18d012ef
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publicationDate 2018-01-11^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2018009195-A1
titleOfInvention Resin film for flexible printed circuit board, metal foil provided with resin, coverlay film, bonding sheet, and flexible printed circuit board
abstract The present invention relates to a resin film for a flexible printed circuit board consisting of a resin composition containing: a long-chain alkyl bismaleimide resin having a main chain containing an alkylene chain having 10 or more carbon atoms and a side chain containing an alkyl group bonded to the alkylene chain; and a curing agent having two or more functional groups reacting with the long-chain alkyl bismaleimide resin.
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