| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_069a92549123806a5d654dc036a676e9 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01P2004-61
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01P2006-80 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-001
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C01G3-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-123
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-08 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D17-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D21-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C01G3-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D17-02 |
| filingDate |
2017-10-09^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b2406cca20e71e5dfca142b9e990e05b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_851e2c94a4083c0d3e8ee96cb2497fb9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_01fd007689512f885e28eb4e4e6e8646
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_032a0b46f16838db85a937ed2eeb70b9 |
| publicationDate |
2018-04-19^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2018105946-A1 |
| titleOfInvention |
Copper oxide powder for use in plating of a substrate, method of plating a substrate using the copper oxide powder, and method of managing plating solution using the copper oxide powder |
| abstract |
Soluble copper oxide powder capable of preventing a decrease in quality of a copper film formed by plating is disclosed. The copper oxide powder contains copper and impurities including sodium. A concentration of the sodium is not more than 20 ppm. The copper oxide powder is regularly supplied into a plating solution. A voltage is applied between an insoluble anode and a substrate immersed in the plating solution, thereby plating the substrate. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2019157145-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2022074063-A1 |
| priorityDate |
2016-10-14^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |