http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2018135196-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_de498babb0c04a00ceb653738877b147 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-18 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-423 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G69-26 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G69-26 |
| filingDate | 2017-12-21^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_510743fcc32f9fa25a9087582a5b105c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5025ec0b4b014f69f44fdef49fb2d282 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_70411ee4380c34b62abd7b7ceace060a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6cf0043543c91e69ec90f43177446f14 |
| publicationDate | 2018-05-17^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | US-2018135196-A1 |
| titleOfInvention | Additive for copper electroplating bath, copper electroplating bath containing said additive, and copper electroplating method using said copper electroplating bath |
| abstract | When copper is filled in a fine groove or hole (hereinafter sometimes referred to as a “trench”) of a base to be plated, which has formed therein the trench, by copper electroplating, the occurrence of voids and the deposition of copper on a region other than the trench have heretofore been problems. To solve the problems, the present invention provides an additive for a copper electroplating bath, consisting of at least one polymer compound selected from polymer compounds each represented by the following general formula (1) or the following general formula (2), each of the polymer compounds having a weight-average molecular weight of from 20,000 to 10,000,000. n n n n n n n n n n (In the formulae, X represents at least one unit selected from units represented by specific structures, and a ratio of a to b, i.e. “a:b” falls within the range of from 10:90 to 99:1.) |
| priorityDate | 2013-04-02^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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