| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f54ea9ae2eeb8fbfc68b14fc8b9ede49
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3fccf91d40fe3ab411eb120752c1c836
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5c76eb497e9f79292642262319fba694
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_77eadbd20549099ae084064f6c296a5c |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-28556
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5226
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76843
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76846
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53238
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5329
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53209 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-522
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-285
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-532 |
| filingDate |
2018-05-10^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cd659970538d5a391e6b04e46a0b07ca
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_78cfc4fd5528500d60161dbebf7bda5a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3bdc65881ed183a7d567417ec35b825e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2237c1c307001a7c3bae3a82235c1574 |
| publicationDate |
2019-11-14^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2019348369-A1 |
| titleOfInvention |
Method and apparatus for protecting metal interconnect from halogen based precursors |
| abstract |
A method and apparatus for forming an interconnect on a substrate is provided. A protective layer is formed on the substrate and in a via formed on the substrate wherein the protective layer is resistant to a halogen containing material. A barrier layer is formed on top of the protective layer. The barrier layer comprises a halogen containing material. A metal layer is deposited over the barrier layer. In another embodiment, the protective layer is selectively deposited in the via. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2021125862-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11680320-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11322502-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2021010135-A1 |
| priorityDate |
2018-05-10^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |