| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0e433c1625fc509a087c912b440da84b |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48465
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-16235
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3114
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49541
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49562
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49575
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-043
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-315
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3107 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-043
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-495 |
| filingDate |
2019-09-17^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4639cca336265946c522056210b28101
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_394035a6022050263633b52daa62641f |
| publicationDate |
2020-01-09^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2020013688-A1 |
| titleOfInvention |
Semiconductor device package with a cap to selectively exclude contact with mold compound |
| abstract |
A described example includes: a die with an active surface; a cap mounted over a portion of the active surface of the die; and mold compound covering the cap and covering portions of the die, the cap excluding the mold compound from contact with the portion of the active surface of the die. |
| priorityDate |
2018-05-15^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |