| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_36333273e27f0db23ddddbf80ba79ba7 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-0145
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2207-07
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-0118
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2201-0132
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2207-095
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2201-0235
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-035
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-0109
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2201-014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2207-096
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2203-0315 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00301
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00293
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-0077
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00515
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-0006 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B7-00 |
| filingDate |
2019-10-28^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d8f7049a6955ab099a441a8fe32b7626
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_392253fe0d0482844877496f68896098
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2da6d3245e11e67c16205e4873c25006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_55412d7c32e9f0de183e7072f5dcb91e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ef51328566d2c73d2283f81e59e7f427 |
| publicationDate |
2020-02-27^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2020062588-A1 |
| titleOfInvention |
MEMS Devices and Methods of Forming Same |
| abstract |
A microelectromechanical system (MEMS) device may include a MEMS structure over a first substrate. The MEMS structure comprises a movable element. Depositing a first conductive material over the first substrate and etching trenches in a second substrate. Filling the trenches with a second conductive material and depositing a third conductive material over the second conductive material and the second substrate. Bonding the first substrate and the second substrate and thinning a backside of the second substrate which exposes the second conductive material in the trenches. |
| priorityDate |
2012-01-04^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |