| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e757fd4fedc4fe825bb81b1b466a0947 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01P1-30 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01P3-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01P3-085
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01P11-003
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01P1-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01P5-085 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01P11-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01P3-08 |
| filingDate |
2018-09-07^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_27f37bed0dc2e3441a035cd1b7c17ca6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_27afaeb2dc04098330fb6bd9b5d2c5a2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a47a17cbcdf7852406820c68f37e0ecc |
| publicationDate |
2020-03-12^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2020083584-A1 |
| titleOfInvention |
Well thermalized stripline formation for high-density connections in quantum applications |
| abstract |
A stripline that is usable in a quantum application (q-stripline) includes a first polyimide film and a second polyimide film. The q-stripline further includes a first center conductor and a second center conductor formed between the first polyimide film and the second polyimide film. The q-stripline has a first pin configured through a first recess in the second polyimide film to make electrical and thermal contact with the first center conductor. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2023041078-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11469485-B2 |
| priorityDate |
2018-09-07^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |