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filingDate 2018-03-08^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2020-03-19^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2020091120-A1
titleOfInvention Semiconductor module, display device, and semiconductor module manufacturing method
abstract Resin covers a side surface and a back surface of a blue LED and holds the blue LED level. An electrode is disposed between a top surface of a wiring substrate and a back surface of the blue LED, extends through the resin, and electrically connects the wiring substrate and the blue LED to each other. A light-outgoing surface (top-surface) of the blue LED is exposed without being covered with the resin, and the light-outgoing surface (top-surface) is flush with a top surface of the resin.
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priorityDate 2017-05-30^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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