| abstract |
A circuit board of the present disclosure includes a substrate, a conductor layer located on the substrate, a reflective layer located on the conductor layer, and a resin layer located on the substrate to be in contact with the conductor layer and the reflective layer. In a surface of the reflective layer, arithmetic mean roughness Ra obtained from a roughness profile is less than 0.2 μm, and a ratio of kurtosis Rku obtained from a roughness profile to skewness Rsk obtained from a roughness profile is 5 or more and 15 or less. |