http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2020276784-A1

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filingDate 2019-04-23^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7f360f18aa600efce31284187500464e
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publicationDate 2020-09-03^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2020276784-A1
titleOfInvention Porous copper composite and mehtod thereof
abstract A method for forming a porous copper composite is provided. At least two carbon nanostructure reinforced copper composite substrates are provided. The at least two carbon nanostructure reinforced copper composite substrates are stacked to form a composite substrate. An active metal layer is disposed on a surface of the composite substrate to form a first a composite structure. The first composite structure is pressed to form a second composite structure. The second composite structure is annealed to form a third composite structure. The third composite structure is de-alloyed to form a porous copper composite.
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