http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2020352023-A1

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filingDate 2020-07-15^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_27ca165b5f3b2a5683a18ffe83088e63
publicationDate 2020-11-05^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2020352023-A1
titleOfInvention Printed circuit board design for high speed application
abstract A printed circuit board includes a substrate having a top surface and a bottom surface. A reference plane is embedded in the substrate and adjacent to the top surface. The printed circuit board also includes a first signal net and a second signal net being in close proximity to each other and disposed within a specific region on the top surface of the substrate. An outermost insulating layer is disposed on the top surface of the substrate to cover the substrate, the first signal net and the second signal net. The outmost insulating layer comprises an opening to expose a portion of the second signal net. A conductive layer is disposed in the opening and on the outermost insulating layer corresponding to the specific region in which the first signal net and the second signal net are arranged, such that the conductive layer overlaps with the first signal net.
priorityDate 2011-03-10^^<http://www.w3.org/2001/XMLSchema#date>
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