| abstract |
A polyimide of the present invention contains an alicyclic acid dianhydride, a fluorine-containing aromatic acid dianhydride and 3′,4,4′-biphenyl-tetracarboxylic acid dianhydride as acid dianhydrides, and contains 3,3′-diaminodiphenyl sulfone and a fluoroalkyl-substituted benzidine as diamines. A polyimide film of the present invention contains the polyimide resin. For example, the polyimide film is obtained by applying a polyimide solution, which is obtained by dissolving the polyimide resin in an organic solvent, onto a substrate, and removing the solvent. |