| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_743a1b516d356cad36e881b57d532842
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9fb7bbc09927d64558e1e99a3b7c719b |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2379-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29K2079-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1032
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29K2995-0026
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29L2007-008
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29L2031-3475 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1032
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1039
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C41-003
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1021
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C41-46 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C41-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C41-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-14 |
| filingDate |
2020-04-07^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b7a28e6f09c8ad98f14966f91d5a6bd4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f52163919065f53c666202bfd1e5cab0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a40b01ae51e4952ff9fa2d1edfb571c7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_794d29c4a1b095b5cf060b88ca526d2d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a9533347c64dc0c012a87214d1cbd0fe |
| publicationDate |
2021-10-07^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2021309804-A1 |
| titleOfInvention |
Colorless transparent copolyamide-imide films with high modulus and low coefficient of thermal expansion and preparation thereof |
| abstract |
A method of preparing a colorless transparent copolyamide-imide resin solution and its fabrication as a thin film has been disclosed. The method details formulations derived from a reaction between one or more units of dianhydride and one or more units of diamine monomers with one or more of the monomers containing fluorine atoms in their structural unit. It enables the fabrication of thin films with superior thermal and mechanical properties along with co-efficient of thermal expansion values as low as 2 ppm/° C. and a tensile modulus as high as 9 GPa. The transparent copolyamide-imide film thus prepared has the potential for utilization in flexible displays such as substrates for thin film transistors (TFT), touch sensor panels (TSP) and cover window in organic light emitting diode (OLED) and liquid crystal display (LCD) applications. |
| priorityDate |
2020-04-07^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |