http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2022251433-A1

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filingDate 2020-06-25^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5866ca7bb5d0e39e2c7bab2636a1bdc3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5192ac6c83db7b6996e858254a713349
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publicationDate 2022-08-11^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2022251433-A1
titleOfInvention Adhesive composition, coverlay film comprising same, and printed circuit board
abstract An adhesive composition, a coverlay film containing the adhesive composition, and a printed circuit board containing the coverlay film are disclosed. The adhesive composition includes an epoxy resin, a binder resin containing at least one species of rubber, and an inorganic filler. The adhesive composition has a viscosity of at most 8,000 cps.
priorityDate 2019-06-25^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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