http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2022387787-A1
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_17cc2e143e369f78bc7ac4166c326752 |
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61N1-0534 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61N1-0551 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61N1-0553 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61N1-36062 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61N1-3752 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A61N1-375 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A61N1-05 |
filingDate | 2020-11-03^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c79c234a1ff24ad1f0c257e35c92e446 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b17845626656c78ec0cf22eacd9bc645 |
publicationDate | 2022-12-08^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | US-2022387787-A1 |
titleOfInvention | Anatomically Contoured Stimulation Leads For High Density Neural Interface |
abstract | The present disclosure relates to implantable neuromodulation devices and methods of fabrication, and in particular to anatomically contoured spinal cord stimulation leads for high density neural interfaces and methods of microfabricating the stimulation leads. Particularly, aspects are directed to a thin film lead assembly that includes a cable having: a first supporting structure formed of dielectric material, a first set of conductive traces formed on the first supporting structure, a second supporting structure formed of dielectric material, and a second set of conductive traces formed on the second supporting structure. The thin film lead assembly also includes an electrode assembly having: a third supporting structure formed of dielectric material, a first set of electrodes in electrical connection with the first set of conductive traces, and a second set of electrodes in electrical connection with the second set of conductive traces. |
priorityDate | 2019-11-04^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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