http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2022411261-A1

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filingDate 2021-02-19^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_229254e391578bf43cb065573100f796
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publicationDate 2022-12-29^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2022411261-A1
titleOfInvention Crossovers for vacuum packaging
abstract In some embodiments, electromechanical systems including a semiconductor layer that has a planar surface and includes conductive and adjacent non-conductive regions and a hermetic seal applied above the planar surface and methods of manufacturing the systems are disclosed. In some embodiments, electromechanical devices that include first and second planar semiconductor layers are disclosed. Each of the semiconductor layers includes conductive regions, and at least one conductive region from each of the layers is electrically coupled to each other. Methods of manufacturing the electromechanical devices are also disclosed.
priorityDate 2020-02-21^^<http://www.w3.org/2001/XMLSchema#date>
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