| abstract |
An electronic circuit module and resulting array, each module having an insulating support body with first, second and third electrical conductive means extending through the body along three mutually perpendicular axes. The plugs and receptacles of the respective conductive means are arranged to provide orientation of the module such that when a plurality of modules are connected together, appropriate circuit connections are made. A recess in each of the modules provides vertical cooling chimneys in the array. The array may be arranged such that one module in each of the cooling chimneys is activated at a given time to minimize the heat accumulation. The triaxially extending electrical conductive means also carries heat toward the array surface to further limit temperature rise within the array. |