| abstract |
PLASTIC SUBSTRATES, SUCH AS POLYPROPYLENE, ABS, ETC. ARE PLATED WITH AN ADHERENT METAL COATING IN A PROCESS WHICH AVOIDS COMPLETELY THE ART-EMPLOYED STEPS OF ETCHING IN A CHROMIC-SULFURIC ACID SOLUTION AS WELL AS THE DEPOSITION OF A THIN COATING OF METAL ON THE SUBSTRATE FROM AN ELECTROLESS PLATING BATH PRIOR TO THE ELECTROLYTIC PLATING OPERATION. PLASTIC SUBSTRATES ARE (1) TREATED WITH A SOLUTION OR DISPERSION OF SULFUR IN A SUITABLE SOLVENT, SUCH AS A TRICHLOROETHYLENE, (2) CONTACTED WITH AN AQUEOUS SOLUTION OF A CUPROUS SALT; SUCH AS CUPROUS CHLORIDE, (3) OPTIONALLY TREATED WITH AN AQUEOUS SOLUTION OF PALLADIUM CHLORIDE AND FINALLY (4) ELECTROPLATED TO FORM A COATING OF THE DESIRED METAL OF THE DESIRED THICKNESS. |