| abstract |
An arrangement of thin film resistive layers for hybrid microcircuits thatliminates electrical contact problems and provides a means for obtaining high precision by trimming. A thin resistive film is deposited on an insulating substrate over a mask. Without breaking vacuum, a second resistive film which is not subject to oxidation is deposited over the first resistive film. The second resistive film is then etched away from portions which are not used as contact points. Since the second resistive material has a different resistivity, it is also used for low value resistive portions in multiple resistor networks. |