| abstract |
The invention relates to a process in which, as essential components, liquid epoxy resins, carboxylic anhydrides, zinc fluoroborate complex compounds, water, tetrahydropyrane and compounds (X) which contain OH groups, COOH groups or both groups together, are reacted. Selective choice of the special quantity ratios results in reaction mixtures which, at low temperature (e.g. at 100 DEG C.), require only short moulding times and have a sufficiently long pot life. As the reaction is only slightly exothermic, the process can be used very advantageously for encapsulating electronic components. |