| abstract |
A curable resin composition comprising (a) a polyphenylene resin, (b) a maleimide compound and/or a cyanate ester compound and (c) at least one compound selected from the group consisting of compounds having one or more acryloyl, methacryloyl, acryloxy or methacryloxy groups is disclosed. The curable resin composition can give a cured resin having resistance to heat, solvent and moisture and adhering property. |