patent/US-4912288-A

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-4912288-A

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filingDate	1986-09-03^^<http://www.w3.org/2001/XMLSchema#date>
grantDate	1990-03-27^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_822b0032de0df18b649731b78c340570 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8cef54ee676567222e35ae6075b29a3c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d8dca8b23a3126d2b5e129c9e1fa1580
publicationDate	1990-03-27^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	US-4912288-A
titleOfInvention	Moulded electric circuit package
abstract	A method of providing an electrical circuit wherein a carrier, which is a film of insulating plastic material with a circuit pattern thereon is supported in a mould and a moulding material is applied by the application of heat and pressure to provide a substrate so that the circuit is embedded in or within a three-dimensional surface of the moulded substrate.
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