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filingDate 1988-08-02^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 1990-10-23^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_04f85ce6b0db80511a1805d328066170
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publicationDate 1990-10-23^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-4965657-A
titleOfInvention Resin encapsulated semiconductor device
abstract A resin encapsulated semiconductor device sealed with an epoxy resin molding material particularly containing a brominated epoxy resin as a flame retardant with the bromine content of 0.5% by weight or less, antimony oxide as a flame retardant in an amount of 2.0% by weight or more and a quaternary phosphonium tetrasubstituted borate as a curing accelerator is excellent in connection reliability at Au/Al junctions and heat resistance.
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