Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_80787665b837ed3eb503bbcd27c0043a http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-239 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-3218 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-38 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-72 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-68 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
filingDate |
1988-08-02^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
1990-10-23^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_04f85ce6b0db80511a1805d328066170 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_41efd12bfc7430d270d5beb676f96d57 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c0dfc94095e71f4dff1cbd4fb57fb14a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_71e6b911531c19605f381bdcb36b658c http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_338e412c05298a82f214ee08db570894 |
publicationDate |
1990-10-23^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-4965657-A |
titleOfInvention |
Resin encapsulated semiconductor device |
abstract |
A resin encapsulated semiconductor device sealed with an epoxy resin molding material particularly containing a brominated epoxy resin as a flame retardant with the bromine content of 0.5% by weight or less, antimony oxide as a flame retardant in an amount of 2.0% by weight or more and a quaternary phosphonium tetrasubstituted borate as a curing accelerator is excellent in connection reliability at Au/Al junctions and heat resistance. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5258426-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5476716-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006183872-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007285876-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8084530-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020263108-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5338781-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0660398-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7593216-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5093712-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5440154-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010171414-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1863044-A1 |
priorityDate |
1987-08-03^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |