patent/US-5001542-A

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5001542-A

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filingDate	1989-11-30^^<http://www.w3.org/2001/XMLSchema#date>
grantDate	1991-03-19^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e06a4ec43665feb2f72f6cadc222d45d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b731e6964c6c1153abd319d4c243ace9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_202d5ba997189c90eb0b5da39fd9ddc5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fe917d59bc4d5ce6ccbbfdc926f2145a
publicationDate	1991-03-19^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	US-5001542-A
titleOfInvention	Composition for circuit connection, method for connection using the same, and connected structure of semiconductor chips
abstract	A composition comprising (A) an epoxy resin type adhesive, (B) particles obtained by coating a nucleus of a curing agent with a film, (C) pressure-deformable electroconductive particles having an average particles size larger than that of the particles (B), and if necessary (D) rigid particles having an average particle size smaller than that of the particles (B), is effective for connecting circuits electrically or connecting a semiconductor chip to a wiring substrate.
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