patent/US-5250600-A

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filingDate	1992-05-28^^<http://www.w3.org/2001/XMLSchema#date>
grantDate	1993-10-05^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_56db04168104eaf65daf59ac84c59c1a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f7f43287690b719607d46f030fac9177
publicationDate	1993-10-05^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	US-5250600-A
titleOfInvention	Low temperature flexible die attach adhesive and articles using same
abstract	Described is a flexible adhesive formulation for bonding a semiconductor device to a flexible substrate and a flexible card containing a semiconductor device which can be processed in a computer.
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priorityDate	1992-05-28^^<http://www.w3.org/2001/XMLSchema#date>
type	http://data.epo.org/linked-data/def/patent/Publication

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