| abstract |
In the static dissipative resin composition of the present invention, fundamentally, at least semiconductor fillers are dispersed in a resin and at least a part of the semiconductor fillers are brought into electrical contact with each other, thereby forming a conductive path. The (alpha) value representing the degree of the nonlinearity of the V-i characteristics at the contact between the semiconductor fillers should be 2-150, and the volume resistivity of the semiconductor filler is desirably 105-1010(Omega).cm, whereby on the employment of a conductive filler or a solid lubricant together with the semiconductor filler, various physical properties of the resin composition are improved. |