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filingDate 1993-10-04^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 1995-11-14^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-5465481-A
titleOfInvention Method for fabricating a semiconductor package
abstract A semiconductor package (100) and module (300) includes a unitary base structure (101) and alignment mechanisms (104). The unitary base structure (101) includes a semiconductor mounting area (102) and encircling walls (103). The structure provides resistance to bowing as compared to a flat base. The lack of bowing provides improved thermal contact to a cold plate of the operating environment. The lack of bowing also reduces certain failure modes. The alignment mechanism (104) aligns module components during assembly, thereby simplifying assembly by eliminating the need for complicated fixtures which hold components in place.
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