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filingDate 1990-11-01^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 1996-04-30^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-5512224-A
titleOfInvention Methods for making circuit boards by vacuum impregnation
abstract A warp-free laminate is produced by winding a first set of strands or filaments about a flat mandrel with a second set of strands being wound transverse to the first set. The two sets may be perpendicular to each other. The filaments are maintained under a controlled tension while being impregnated with a resin and during subsequent cure of the resin. In order to permit the formation of a warp-free product, the winding pattern is such that it forms a mirror image about a neutral axis or plane of symmetry. The winding pattern may be chosen to provide interstices in a predetermined pattern determining punching out or high speed drilling of hole openings for subsequent printed circuit applications.
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