| abstract |
Disclosed herein is a method for electrically conductive metal-to-metal bonding. The method for bonding flat metal surfaces comprises the steps of depositing a thin layer of titanium on a first surface of a first metal surface, placing the first surface of the first metal surface in contact with a first surface of a second metal surface in an inert ambiance, heating the inert ambiance to a temperature substantially below the melting point of the metal surfaces, and forming a titanium metal bond between the first metal surface and the second metal surface to provide a low resistive path between the first metal surface and the second metal surface. |